At Norlux, our goal is to innovate and update current product generations to ensure the best customized solution for your needs- both now and into the future. So when we partnered with an aviation company to make an intelligent outlet for aircrafts, utilizing GFI and over-current detection was simply not good enough. Our customer wanted us to add more protection to create the safest product in the air.
An FAA memorandum on power systems in airplanes, PS-ANM-01-111-165, requires that “…the design does not introduce a source of injury due to electrical shock…” While electrical shock can be guarded against with the use of a plug cover and still meet the requirements, it can be easily circumvented in real world applications. We wanted added protection for when the cover is removed and the outlet is exposed. The memorandum offers an optional example of such protection, suggesting “a design where output power is present at the PSS [power supply system] socket only when the PED [portable electronic device] connector is correctly mated with the socket.” Our design does just that; only a proper insertion of a plug activates power to the socket.
This extra level of protection was accomplished by adding plug presence detection (PPD) to the outlet. With PPD, the intelligent outlet does not supply power to the receptacle unless a plug is detected in the outlet. This prevents an individual from an electrical shocked caused by inserting a foreign object- a paperclip, a child’s toy, a piece of food- into the outlet. The PPD detection uses infrared emitters/receivers embedded into the side of the outlet to detect when a plug is in the outlet. Unlike some designs that only have one sensor in the outlet, our design uses two separate emitters/receivers as a redundancy check. With one sensor for each prong, the dual sensor design ensures that it is in fact a plug that is inserted into the outlet, and not a conductive object inserted into only one side. The sensor system can also be calibrated once the outlet is installed so that any ambient inferred light will be compensated for, preventing any false detections. The PPD also correctly detects all plugs styles that can fit into the universal outlet faceplate.
On top of the strict guidelines required to make the outlet safe for aviation use, we have gone above and beyond to ensure a high-quality product for our customer and the safest device for the end user. Contact Norlux today for a consultation on your LED lighting project.
Reference:
http://rgl.faa.gov/Regulatory_and_Guidance_Library/rgPolicy.nsf/0/6283af43db9a694486256fd30077ca7d/$FILE/PSSforPED.pdf
Tuesday, October 30, 2012
Thursday, October 25, 2012
Combining Surface Mount Technology (SMT) & Microelectronics Assembly
Throughout the history of electronics manufacturing, there have been distinct boundaries between those that assemble SMT components and those that assemble microelectronics. In today’s market, it is difficult to identify a U.S. source for low-volume prototype services that offers both disciplines.
SMT and microelectronics die and wire bond services are not usually found in one contract assembly location. In the past, organizations had to deal with two different companies to fulfill build requirements. For example, hybrids or chip on board (COB) integrate wire bonding directly on the board.
The specific application, process requirements, thermal considerations and printed circuit board characteristics all must be accounted for when determining how and when to involve the precise sequence of SMT and microelectronics assembly. With proper planning, manufacturers can take a product from design to volume-production at a lower cost, in a shorter time and with less risk than a company not specialized in these technologies trying to do the prototyping, manufacturing and test on its own.
Although these SMT and microelectronics assembly have been--traditionally--separate, more manufacturers are faced with both SMT and microelectronics build requests since many boards and assemblies are requiring mixed technologies. Microelectronics assemblies require a class 100,000 cleanroom for most operations with some of the sub-processes requiring class 10,000. Expertise is expected in process engineering, die attach, wire bonding, and custom deliverable parts. Most companies looking to outsource these processes want someone with 15-to-20 years of experience in building microelectronics parts.
Taking into account and planning of SMT and microelectronics assembly simultaneously has many advantages. Simultaneous production planning enables process engineers to look at the total product rather than at one board or view it in isolation. Temperature plays a large part in determining the order of assembly; maximum temperature requirements for wire bonding can be different than for other components. Working together enables an evaluation of which part needs which processes and at what temperature profile so as not to destroy other elements of the component or adjacent wire bonds.
Norlux's team of engineers understand SMT and micreoelectronic assembly like no other manufacturer in the world today. Contact us today to discuss your LED based lighting projects.
Blog re-published with permission. Authored originally by Jessica Sylvester on Oct 09, 2012
http://www.palomartechnologies.com/blog/bid/109934/Combining-Surface-Mount-Technology-SMT-Microelectronics-Assembly
SMT and microelectronics die and wire bond services are not usually found in one contract assembly location. In the past, organizations had to deal with two different companies to fulfill build requirements. For example, hybrids or chip on board (COB) integrate wire bonding directly on the board.
The specific application, process requirements, thermal considerations and printed circuit board characteristics all must be accounted for when determining how and when to involve the precise sequence of SMT and microelectronics assembly. With proper planning, manufacturers can take a product from design to volume-production at a lower cost, in a shorter time and with less risk than a company not specialized in these technologies trying to do the prototyping, manufacturing and test on its own.
Although these SMT and microelectronics assembly have been--traditionally--separate, more manufacturers are faced with both SMT and microelectronics build requests since many boards and assemblies are requiring mixed technologies. Microelectronics assemblies require a class 100,000 cleanroom for most operations with some of the sub-processes requiring class 10,000. Expertise is expected in process engineering, die attach, wire bonding, and custom deliverable parts. Most companies looking to outsource these processes want someone with 15-to-20 years of experience in building microelectronics parts.
Taking into account and planning of SMT and microelectronics assembly simultaneously has many advantages. Simultaneous production planning enables process engineers to look at the total product rather than at one board or view it in isolation. Temperature plays a large part in determining the order of assembly; maximum temperature requirements for wire bonding can be different than for other components. Working together enables an evaluation of which part needs which processes and at what temperature profile so as not to destroy other elements of the component or adjacent wire bonds.
Norlux's team of engineers understand SMT and micreoelectronic assembly like no other manufacturer in the world today. Contact us today to discuss your LED based lighting projects.
Blog re-published with permission. Authored originally by Jessica Sylvester on Oct 09, 2012
http://www.palomartechnologies.com/blog/bid/109934/Combining-Surface-Mount-Technology-SMT-Microelectronics-Assembly
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