SMT and microelectronics die and wire bond services are not usually found in one contract assembly location. In the past, organizations had to deal with two different companies to fulfill build requirements. For example, hybrids or chip on board (COB) integrate wire bonding directly on the board.
The specific application, process requirements, thermal considerations and printed circuit board characteristics all must be accounted for when determining how and when to involve the precise sequence of SMT and microelectronics assembly. With proper planning, manufacturers can take a product from design to volume-production at a lower cost, in a shorter time and with less risk than a company not specialized in these technologies trying to do the prototyping, manufacturing and test on its own.
Although these SMT and microelectronics assembly have been--traditionally--separate, more manufacturers are faced with both SMT and microelectronics build requests since many boards and assemblies are requiring mixed technologies. Microelectronics assemblies require a class 100,000 cleanroom for most operations with some of the sub-processes requiring class 10,000. Expertise is expected in process engineering, die attach, wire bonding, and custom deliverable parts. Most companies looking to outsource these processes want someone with 15-to-20 years of experience in building microelectronics parts.
Taking into account and planning of SMT and microelectronics assembly simultaneously has many advantages. Simultaneous production planning enables process engineers to look at the total product rather than at one board or view it in isolation. Temperature plays a large part in determining the order of assembly; maximum temperature requirements for wire bonding can be different than for other components. Working together enables an evaluation of which part needs which processes and at what temperature profile so as not to destroy other elements of the component or adjacent wire bonds.
Norlux's team of engineers understand SMT and micreoelectronic assembly like no other manufacturer in the world today. Contact us today to discuss your LED based lighting projects.
Blog re-published with permission. Authored originally by Jessica Sylvester on Oct 09, 2012
http://www.palomartechnologies.com/blog/bid/109934/Combining-Surface-Mount-Technology-SMT-Microelectronics-Assembly
